ChipQuik Solder Paste No-Clean Sn63/Pb37 - SMD291AX

Price:

24,00 €


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ChipQuik Solder Paste No-Clean Sn63/Pb37 - SMD291AX

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ChipQuik Solder Paste - SMD291AX - No-Clean Sn63/Pb37 in 5cc Syringe 15g T3 Mesh

24,00 € 24.0 EUR 24,00 € inkl. MwSt.

20,17 € inkl. MwSt.

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    Interne Referenz :
    991153
    Barcode :
    991153
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    ChipQuik — SMD291AX · No-Clean Solder Paste

    ChipQuik Solder Paste No-Clean Sn63/Pb37
    SMD291AX · 5cc Syringe · 15g · T3 Mesh

    A professional-grade no-clean solder paste in a convenient 5cc syringe, formulated with eutectic Sn63/Pb37 alloy for reliable SMD rework, PCB repair, and BGA reballing. The T3 mesh particle size and no-clean flux eliminate the need for post-solder cleaning while delivering consistent, repeatable joints.

    Sn63/Pb37
    Alloy
    No-Clean
    Flux Type
    15g
    5cc Syringe
    T3
    Mesh Size

    Key Features

    Eutectic Sn63/Pb37 Alloy
    The 63/37 tin-lead ratio is the eutectic composition, meaning it melts and solidifies at a single point (183 C) rather than a range — producing bright, reliable joints with minimal bridging risk.
    No-Clean Flux Formula
    Flux residues left after reflow are non-corrosive and electrically inert. Post-solder cleaning is not required, saving time on rework and repair workflows while keeping boards clean and safe.
    T3 Mesh Particle Size
    Type 3 mesh (approximately 25-45 micron particles) is well-suited for fine-pitch SMD components and standard BGA reballing work, providing smooth paste flow through a syringe tip without clogging.
    Ready-to-Use Syringe Format
    The 5cc syringe allows precise, controlled paste deposition directly onto pads or under components — no stencil required for rework applications. Ideal for benchtop technicians and repair shops.

    Technical Specifications

    Brand ChipQuik
    Model / Part Number SMD291AX
    Alloy Composition Sn63/Pb37 (63% Tin, 37% Lead)
    Melting Point 183 C (eutectic — single-point solidification)
    Flux Type No-Clean
    Particle / Mesh Size T3 (~25-45 microns)
    Package Format 5cc Syringe
    Net Weight 15g
    Typical Applications SMD rework, PCB repair, BGA reballing, pad repair
    SKU 991153

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    SMD291AX-746153.pdf
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    Last updated 15-05-2026 · AR COMPUTER G CO. LTD
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